Substrate for use in manufacturing display device and method for forming element on substrate

ABSTRACT

A substrate is for use in manufacturing a display device. The substrate includes a first area that corresponds to pixel positions. The substrate further includes a second area adjacent to the first area. The substrate further includes a first mark disposed in the second area, wherein a first virtual line corresponds to the first mark. The substrate further includes a second mark disposed in the second area and spaced from the first mark, wherein a second virtual line corresponds to the second mark and intersects the first virtual line at a virtual reference point. The substrate further includes an indicator disposed in the second area, spaced from the first mark and the second mark, and corresponding to an opening of a mask, wherein a positional relation between the virtual reference point and a point of the indicator represents a positional relation between the substrate and the mask.

RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 14/027,042 filed on Sep. 13, 2013, which claims priority to andthe benefit of Korean Patent Application No. 10-2013-0062048 filed inthe Korean Intellectual Property Office on May 30, 2013, the entirecontents of which are incorporated herein by reference.

BACKGROUND

1. Field

The present invention relates to a substrate for a display device and amethod for depositing a thin film.

2. Description of the Related Art

An organic light emitting display typically includes a substrate and aplurality of pixels formed on the substrate. Each of the pixels includesa pixel circuit and an organic light emitting diode of which emissionmay be controlled by the pixel circuit. The organic light emitting diodemay have a stacked structure that may include a pixel electrode, anorganic emission layer, and (a portion of) a common electrode. Theorganic light emitting display may use lights emitted from a pluralityof organic light emitting diodes to display an image.

The organic emission layer may be formed using a pattern mask that has aplurality of openings corresponding to a design of the organic emissionlayer. The pattern mask may be fixed to a frame with a tensile forcebeing applied to the pattern mask. The combination of the mask and theframe may be arranged on the substrate inside a chamber. A depositionsource may also be disposed inside the chamber. An organic materialevaporated from the deposition source may pass through the opening ofthe pattern mask and may be deposited on the substrate so as to form theorganic emission layer.

During the deposition process, if an error occurs in the alignmentbetween the substrate and the pattern mask, the error may cause aprocess failure. Therefore, accuracy in the alignment between thesubstrate and the pattern mask is very important in manufacturing theorganic light emitting display.

The above information disclosed in this Background section is forenhancement of understanding of the background of the describedtechnology. The Background section may contain information that does notform the prior art that is already known in this country to a person ofordinary skill in the art.

SUMMARY

An embodiment of the present invention may be related to a substrate foruse in manufacturing a display device. The substrate may facilitatesubstantially accurate alignment between a mask and the substrate and/orsubstantially accurate alignment between the mask and other substrates.Advantageously, material may be deposited through the mask atsubstantially accurate positions on a substrate used in the displaydevice, and satisfactory quality of the display device may be provided.

The substrate may include a first area that corresponds to a pluralityof pixel positions. The substrate may further include a second areaadjacent to the first area. The substrate may further include a firstmark disposed in the second area, wherein a first virtual linecorresponds to the first mark. The substrate may further include asecond mark disposed in the second area and spaced from the first mark,wherein a second virtual line corresponds to the second mark andintersects the first virtual line at a first virtual reference point.The substrate may further include a first indicator disposed in thesecond area, spaced from each of the first mark and the second mark, andcorresponding to a first opening of a mask, wherein a positionalrelation between the first virtual reference point and a point of thefirst indicator represents a positional relation between the substrateand the mask.

The substrate may include a first-colored layer having a first color,formed of an organic material, and disposed in a first pixel position ofthe plurality of pixel positions, wherein the first indicator is formedof the organic material.

The substrate may include a first-colored layer having a first color anddisposed in a first pixel position of the plurality of pixel positions,wherein the first virtual line overlaps the first-colored layer andoverlaps the first indicator.

The substrate may include a third mark disposed in the second area andspaced from each of the first mark, the second mark, and the firstindicator, wherein a third virtual line corresponds to the third markand intersects the second virtual line at a second virtual referencepoint that is spaced from the first virtual reference point. Thesubstrate may further include a second indicator disposed in the secondarea, spaced from each of the first mark, the second mark, the thirdmark, and the first indicator, and corresponding to a second opening ofthe mask, The substrate may further include a second-colored layerhaving a second color different from the first color and disposed in asecond pixel position of the plurality of pixel positions, wherein thethird virtual line overlaps the second-colored layer and overlaps thesecond indicator.

Each of the first virtual line and the third virtual line may extend ina first direction. The first mark may be aligned with the third mark ina second direction that is different from the first direction.

A first side of the second mark may be longer than a second side of thesecond mark and extends in the second direction.

A center point of the first indicator may coincide with the firstvirtual reference point.

The substrate may include a third mark disposed in the second area andspaced from each of the first mark, the second mark, and the firstindicator. The substrate may further include a fourth mark disposed inthe second area and spaced from each of the first mark, the second mark,the third mark, and the first indicator. The first virtual line mayfurther correspond to the fourth mark. The second virtual line mayfurther correspond to the third mark. The first indicator may bedisposed between the first mark and the fourth mark. The first indicatormay be disposed between the second mark and the third mark.

The first mark may be aligned with the second mark in a first direction.The first mark may be aligned with the third mark in a second directiondifferent from the first direction. The third mark may be aligned withthe fourth mark in the second direction.

A distance between a center the first mark and a center of the thirdmark may be equal to a multiple of a double of a distance between acenter of a first pixel position of the plurality of pixel positions anda center of a second pixel position of the plurality of pixel positions,wherein the second pixel position immediately neighbors the first pixelposition.

An embodiment of the invention may be related to a method for forming atleast one element on at least one substrate. The method may include thefollowing steps: disposing a first substrate and a mask in a chamber,wherein the first substrate includes a first area corresponding to aplurality of pixel positions, a second area adjacent to the first area,a first mark disposed in the second area, and a second mark disposed inthe second area and spaced from the first mark, wherein a first virtualline corresponds to the first mark, wherein a second virtual linecorresponds to the second mark and intersects the first virtual line ata first virtual reference point, and wherein the mask has a firstopening and a second opening; using the mask to form a first indicatorin the second area, wherein the first indicator is spaced from each ofthe first mark and the second mark and corresponds to the first opening;and using positional relation between the first virtual reference pointand a point of the first indicator to assess a positional relationbetween the first substrate and the mask.

The method may include the following steps: determining that a distancebetween the first virtual reference point and the point of the firstindicator has a first value; determining that the first value isunacceptable; adjusting at least one of a position of the mask and aposition of the first substrate such that the distance between the firstvirtual reference point and the point of the first indicator has asecond value that is acceptable; and after the adjusting, using the maskto form a deposited element in a first pixel position of the pluralityof pixel positions, wherein the deposited element corresponds to thesecond opening.

The method may include the following steps: determining that a distancebetween the first virtual reference point and the point of the firstindicator has a first value; determining that the first value isunacceptable; adjusting at least one of a position of the mask and aposition of the first substrate such that the first substrate is at anacceptable position and such that the distance between the first virtualreference point and the point of the first indicator has a second valuethat is acceptable; after the adjusting, disposing a second substrate atthe acceptable position; and using the mask to form a first depositedelement on the second substrate, wherein the first element layercorresponds to the second opening.

The method may include the following steps: when forming the firstindicator, using the mask to form a second deposited element in a firstpixel position of the plurality of pixel positions, wherein the seconddeposited element corresponds to the second opening; and after theadjusting and before disposing the second substrate in the chamber,removing the first substrate from the chamber.

The method may include the following steps: determining that a distancebetween the first virtual reference point and the point of the firstindicator is acceptable; and after the determining, using the mask toform a deposited element in a first pixel position of the plurality ofpixel positions, wherein the deposited element corresponds to the secondopening.

The method may include the following steps: when forming the firstindicator, using the mask to form a deposited element in a first pixelposition of the plurality of pixel positions, wherein the depositedelement corresponds to the second opening; and determining whether adistance between the first virtual reference point and the point of thefirst indicator is acceptable.

A first side of the first mark may be longer than a second side of thefirst mark and extends in a first direction. A first side of the secondmark may be longer than a second side of the second mark and extends ina second direction different from the first direction.

The first substrate may further include a third mark and a fourth mark.The third mark may be disposed in the second area and may be spaced fromeach of the first mark and the second mark. The fourth mark may bedisposed in the second area and may be spaced from each of the firstmark, the second mark, and the third mark. The first virtual line mayfurther correspond to the fourth mark. The second virtual line mayfurther correspond to the third mark. The first indicator may be formedbetween the first mark and the fourth mark. The first indicator may beformed between the second mark and the third mark.

The first mark may be aligned with the second mark in a first direction.The first mark may be aligned with the third mark in a second directiondifferent from the first direction. The third mark may be aligned withthe fourth mark in the second direction.

A distance between a center the first mark and a center of the thirdmark may be equal to a multiple of a double of a distance between acenter of a first pixel position of the plurality of pixel positions anda center of a second pixel position of the plurality of pixel positions,the second pixel position immediately neighboring the first pixelposition.

An embodiment of the invention may be related to a substrate for use inmanufacturing a display device. The substrate may include the followingelements: a first area having a plurality of pixels (or pixel positions)formed therein; and a second area having an alignment mark and a thinfilm for a test (or indicator for calibrating alignment) formed therein.The alignment mark may include at least two marks of which a referencepoint is set by a virtual intersecting point, and the thin film for thetest may be spaced apart from the alignment mark.

Distances between a center point of the thin film for the test and thereference point may correspond to an alignment error between thesubstrate and a pattern mask.

Each of the plurality of pixels may include a thin film transistor, acapacitor, and a pixel electrode. At least one of the plurality ofpixels may further include an organic emission layer. The plurality ofpixels may be arranged in a first direction and a second directioncrossing the first direction.

The alignment mark may include a first mark having two long sidesparallel to the first direction; and a second mark spaced apart from thefirst mark in the first direction and having two long sides parallel tothe second direction. The reference point may be set as a point where acenter line of the first mark and a center line of the second markintersect.

The plurality of pixels may include a pixel column arranged in the firstdirection, and the center line of the first mark may match a center lineof the pixel column. The plurality of pixels may have a plurality ofcolors, and the first mark and the thin film for the test may be formedat least one by one for each color of the pixels.

The alignment mark may include a third mark and a fourth mark in a dotshape located on one line in the first direction; and a fifth mark and asixth mark in a dot shape spaced apart from the third mark and thefourth mark with equal distances in the second direction. The referencepoint may be set as a point where a connection line between the thirdmark and the sixth mark and a connection line between the fourth markand the fifth mark intersect.

The plurality of pixels may include a pixel column arranged in the firstdirection, and the third mark and the fourth mark may be located on thecenter line of the pixel column. The center of the fifth mark and thecenter of the sixth mark may be spaced apart from the center of thethird mark and the center of the fourth mark with a distancecorresponding to a double of a pixel pitch in the second direction. Theplurality of pixels may have a plurality of colors, and the alignmentmark and the thin film for the test may be formed at least one by onefor each color of the pixels.

An embodiment of the invention may be related to a method for depositingat least one element on at least one substrate. The method may includethe following steps: preparing a substrate having a plurality of pixelsand an alignment mark of which a reference point is set by a virtualintersecting point formed therein, and a pattern mask having a pluralityof openings formed therein, and putting the substrate and the patternmask into a deposition chamber and aligning the substrate and thepattern mask; forming a thin film for a test on the substrate with adistance from the alignment mark; and photographing the alignment markand the thin film for the test in measurement equipment, and measuringan alignment error between the substrate and the pattern mask bymeasuring distances between the reference point by the alignment markand a center point of the thin film for the test.

An organic emission layer may be formed on the plurality of pixelssimultaneously when the thin film for the test is formed, and asucceeding substrate may be put into the deposition chamber and remainsin a standby state after the thin film for the test and the organicemission layer are formed.

A substrate determined as a faulty substrate among the substrates in themeasurement equipment may be discarded, the alignment error may becorrected by moving one of the succeeding substrate and the patternmask, and the organic emission layer may be formed on a plurality ofpixels formed on the succeeding substrate. A substrate determined as asubstrate of fair quality among the substrates in the measurementequipment may be transported to a succeeding process, and the organicemission layer may be formed on a plurality of pixels formed on thesucceeding substrate.

The substrate having completed an error measurement in the measurementequipment may be put into the deposition chamber again, and the organicemission layer may be formed on the plurality of pixels. When thealignment error is measured in the measurement equipment, the alignmenterror may be corrected by moving one of the substrate and the patternmask before the organic emission layer is formed.

The plurality of pixels may be arranged in a first direction and asecond direction crossing the first direction and have a plurality ofcolors.

The alignment mark may include a first mark having two long sidesparallel to the first direction and a second mark having two long sidesparallel to the second direction. The reference point may be set as apoint where a center line of the first mark and a center line of thesecond mark intersect.

The alignment mark may include a third mark and a fourth mark located onone line in the first direction, and a fifth mark and a sixth markspaced apart from the fifth mark and the sixth mark with equal distancesfrom the third mark and the fourth mark in the second direction. Thereference point may be set as a point where a connection line betweenthe third mark and the sixth mark and a connection line between thefourth mark and the fifth mark intersect.

The alignment mark and the thin film for the test may be formed at leastone by one for each color of the pixels, and the alignment error betweenthe substrate and the pattern mask may be measured at least one by onefor each color of the pixels.

According to embodiments of the invention, a thin film for a test (orindicator for calibrating alignment) does not overlap an alignment mark,so that a measurement range of a measurement equipment may not belimited by the alignment mark. Accordingly, the measurable range may bemaximized, and substantially accurate measurement may be performed.According to embodiments of the invention, interference between an imageof an alignment mark and an image of an alignment indicator may beprevented given that the indicator is spaced from the mark.Advantageously, alignment calibration may be substantially accuratelyperformed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a substrate for use in adisplay device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a pixel of the substrateillustrated in FIG. 1 according to an embodiment of the presentinvention.

FIG. 3 is a plan view illustrating a portion of the substrateillustrated in FIG. 1 according to an embodiment of the presentinvention.

FIG. 4 is a plan view provided for discussing some elements illustratedin FIG. 3 according to an embodiment of the present invention.

FIG. 5 is a plan view illustrating a portion of a substrate for use in adisplay device according to an embodiment of the present invention.

FIG. 6 is a plan view provided for discussing some elements illustratedin FIG. 5 according to an embodiment of the present invention.

FIG. 7 is a flowchart illustrating a method for forming at least oneelement on at least one substrate according to an embodiment of thepresent invention.

FIG. 8 is a view schematically illustrating steps illustrated in FIG. 7according to an embodiment of the present invention.

FIG. 9 is a plan view illustrating a pattern mask according to anembodiment of the present invention.

FIG. 10 is a view schematically illustrating a substrate and ameasurement equipment used in a step illustrated in FIG. 7 according toan embodiment of the present invention.

DETAILED DESCRIPTION

The present invention is described more fully hereinafter with referenceto the accompanying drawings, in which embodiments of the invention areshown. As those skilled in the art would realize, the describedembodiments may be modified in various different ways, all withoutdeparting from the spirit or scope of the present invention.

In the description and claims, if a part “includes” a component, thepart may further include zero or more additional components. In thedescription and claims, when it is described that a first element (suchas one of a layer, a film, an area, a plate, etc.) is “on” or “above” asecond element, it may mean that the first element directly contacts thesecond element, or it may mean that a third element exists between thefirst element and the second element.

Although the terms first, second, etc. may be used herein to describevarious signals, elements, components, regions, layers, and/or sections,these signals, elements, components, regions, layers, and/or sectionsshould not be limited by these terms. These terms may be used todistinguish one signal, element, component, region, layer, or sectionfrom another signal, region, layer, or section. Thus, a first signal,element, component, region, layer, or section discussed below may betermed a second signal, element, component, region, layer, or sectionwithout departing from the teachings of the present invention. Thedescription of an element as a “first” element may not require or implythe presence of a second element or other elements. The terms first,second, etc. may also be used herein to differentiate differentcategories of elements. For conciseness, the terms first, second, etc.may represent first-type (or first-category), second-type (orsecond-category), etc., respectively.

In the description, the term “connect” may mean “electrically connect”;the term “insulate” may mean “electrically insulate”.

FIG. 1 is a perspective view illustrating a substrate 100 for use in adisplay device according to an embodiment of the present invention.

Referring to FIG. 1, the substrate 100 includes a first area A10 and asecond area A20 adjacent to (and surrounding) the first area A10. Aplurality of pixels PE (each including a pixel electrode) is located inthe first area A10 on a base substrate 10 of the substrate 100. Analignment mark 50 and a thin film 60 (or indicator 60) for use in a test(or alignment calibration) are located in the second area A20.

The thin film 60 may be formed before or when an organic emission layeris formed in the first area A10. The thin film 60 may be used foridentifying an error in the alignment between the substrate 100 and apattern mask based on a location relation with the alignment mark 50.

A pixel PE may include a pixel circuit (which may include a thin filmtransistor and a capacitor), a pixel electrode and an organic emissionlayer. The pixel PE may further include a portion of a common electrode.

FIG. 2 is a cross-sectional view illustrating a pixel PE of thesubstrate 100 illustrated in FIG. 1 according to an embodiment of thepresent invention.

Referring to FIGS. 1 and 2, a buffer layer 11, a thin film transistor20, a capacitor 30, and a pixel electrode 41 are located on the basesubstrate 10. The base substrate 10 may be a rigid substrate (such as aglass substrate) or a flexible substrate (such as a polymer film). Apolymer film may have a higher water vapor transmittance rate and oxygentransmittance rate in comparison with a glass substrate. In anembodiment, the base substrate 10 is formed of a polymer film, and abarrier layer for minimizing water and oxygen permeation may be locatedbetween the base substrate 10 and the buffer layer 11.

The buffer layer 11 is formed of an inorganic film and includes, forexample, SiO₂ or SiNx. The buffer layer 11 provides a flat surface forforming the pixel circuit and suppresses permeation of water and/orother foreign substances into the pixel circuit (which includes the thinfilm transistor 20 and the capacitor 30) and the organic light emittingdiode 40.

The thin film transistor 20 and the capacitor 30 are formed on thebuffer layer 11. The thin film transistor 20 includes a semiconductorlayer 21, a gate electrode 22, a source electrode 23, and a drainelectrode 24. The semiconductor layer 21 is formed of a polysilicon oroxide semiconductor. The semiconductor layer 21 includes a (non-doped)channel area 211, an impurity doped source area 212 disposed at a firstside of the channel area 211, and an impurity doped drain 213 disposedat a second side of the channel area 211. In an embodiment, thesemiconductor layer 21 is formed of an oxide semiconductor, and thepixel PE may include an additional passivation layer for protecting thesemiconductor layer 21.

A portion of a gate insulating layer 12 is located between thesemiconductor layer 21 and the gate electrode 22, and a portion of aninterlayer insulating layer 13 is located between the gate electrode 22and the electrodes 23 and 24. The capacitor 30 includes a firstcapacitance plate 31 formed on the gate insulating layer 12 and includesa second capacitance plate 32 formed on the interlayer insulating layer13. The first capacitance plate 31 may be formed of the same material asthat of the gate electrode 22, and the second capacitance plate 32 maybe formed of the same material as that of the electrodes 23 and 24. Thesecond capacitance plate 32 may be connected to the source electrode 23.

The thin film transistor 20 illustrated in FIG. 2 is a driving thin filmtransistor, and the pixel circuit further includes a switching thin filmtransistor (not shown). The switching thin film transistor is used as aswitching device that selects a pixel to emit light, and the drivingthin film transistor applies power for the selected pixel to emit light.

A planarization layer 14 (or insulating layer 14) is located on theelectrodes 23 and 24 and the second capacitance plate 32. Theplanarization layer 14 may be formed of an organic material, aninorganic material, or a combination of an organic material and aninorganic material. The planarization layer 14 has a via (or hole) thatexposes a part of the drain electrode 24. The pixel electrode 41 and apixel defining layer 15 are formed on the planarization layer 14.

The pixel electrode 41 is insulated from the pixel electrodes 41 ofother pixels and is connected to the drain electrode 24 of the thin filmtransistor 20 through the via (or hole). The pixel defining layer 15 isformed between the pixel electrodes 41 of different pixels to partitionpixel areas and has openings that expose the pixel electrodes 41. Theorganic emission layer 42 is formed on (and contacts) the exposed pixelelectrode 41.

The organic emission layer 42 may be formed when the thin film 60 isformed or may be formed after error correction using the alignment mark50 and the thin film 60 for the test has been completed. After theorganic emission layer 42 has been formed, the common electrode 43 isformed substantially completely throughout the first area A10 so as toform an organic light emitting diode 40 with the pixel electrode 41 andthe organic emission layer 42 in each pixel PE.

The organic emission layer 42 may be one of a red emission layer, agreen emission layer, and a blue emission layer. One of the pixelelectrode 41 and the common electrode 43 is an anode (i.e., a holeinjection electrode), and the other is a cathode (i.e., an electroninjection electrode). A hole injected from the anode and an electroninjected from the cathode are combined in the organic emission layer 42to generate an exciton, and light is emitted while the exciton releasesenergy.

At least one of a hole injection layer and a hole transport layer may belocated between the anode and the organic emission layer 42, and atleast one of an electron injection layer and an electron transport layermay be located between the cathode and the organic emission layer 42.The hole injection layer, the hole transport layer, the electrontransport layer, and electron injection layer may be formedsubstantially completely throughout the first area A10.

One of the pixel electrode 41 and the common electrode 43 may be areflective layer, and the other may be a transflective film or atransparent conductive layer. Light emitted from the organic emissionlayer 42 is reflected in the reflective layer and is transmitted throughthe transflective film or the transparent conductive layer to theoutside. The transflective film and the reflective layer may form aresonance structure for a part of the light emitted from the organicemission layer 42 to be re-reflected by the reflective layer.

Configurations of the thin film transistor 20 and the capacitor 30illustrated in FIG. 2 are illustrative. The substrate 100 according toembodiments of the invention is not limited to the illustrated examples.

FIG. 3 is a plan view illustrating a portion of the substrate 100illustrated in FIG. 1 according to an embodiment of the presentinvention.

Referring to FIGS. 1 and 3, the plurality of pixels PE may be aligned ina first direction on the substrate 100 and a second direction crossingthe first direction. In an embodiment, the first direction and thesecond direction may be orthogonal to each other. In an embodiment, theplurality of pixels PE may be arranged in a zigzag pattern.

Each of the plurality of pixels PE and the plurality of organic emissionlayers 42 included in the pixels may be formed in one or more of variousshapes, such as a rectangle having round corners, a track, a triangle, arhombus, and so on. In FIG. 3, the plurality of pixels PE isschematically illustrated in a quadrangular shape.

In an embodiment, pixels PE having the same color may be arranged in oneof the first direction and the second direction, and pixels PE havingdifferent colors may be alternately arranged in the other direction. Inan embodiment, pixels PE having at least two colors may be alternatelylocated in the first direction and the second direction. In anembodiment, as illustrated in FIG. 3, pixels PE having the same colorare arranged in the first direction, and pixels PE having differentcolors are alternately located in the second direction.

The alignment mark 50 includes at least two marks for forming areference point that is set at a virtual intersecting point where atleast two lines corresponding to the marks intersect each other. In anembodiment, the alignment mark 50 includes a first mark 51 and a secondmart 52. The first mark 51 has a bar shape having two long sidesextending in the first direction. The second mark 52 has a bar shapehaving two long sides extending in the second direction. The second mark52 may be separated from the first mark 51 in the first direction.

Accordingly, when images of the first mark 51 and the second mark 52 arecaptured (e.g., photographed) by a measurement equipment (not shown)that includes an imaging camera, a controller of the measurementequipment can recognize a center line corresponding to the first mark 51(i.e., a virtual line that extends in the first direction across thefirst mark 51 and passes through the center of the first mark 51) and acenter line corresponding to the second mark 52 (i.e., a virtual linethat extends in the second direction across the second mark 52 andpasses through the center of the second mark 52) through softwareprocessing. Further, the controller of the measurement equipment canrecognize a point where the center line corresponding to the first mark51 and the center line corresponding to the second mark 52 intersect asa reference point P1.

The center line corresponding to the first mark 51 is parallel to thetwo long sides of the first mark 51 and keeps the same distance from thetwo long sides. The center line corresponding to the second mark 52 isparallel to the two long sides of the second mark 52 and keeps the samedistance from the two long sides.

The reference point P1 set by the first mark 51 and the second mark 52is used to indicate a central location (or center) of an opening of apattern mask (not shown) used for forming the thin film 60 for use inperforming the test. In an embodiment, the opening for forming the thinfilm 60 is formed in the pattern mask, and the first mark 51 and thesecond mark 52 are formed on the base substrate 100 to indicate thecentral location of the opening.

The center line corresponding to the first mark 51 may match a centerline corresponding to a column of the pixels PE in the first direction.In an embodiment, the reference point P1 (set by the first mark 51 andthe second mark 52) is aligned with centers of pixels PE that arearranged in a column in the first direction.

The opening (hereinafter referred to as a first opening) of the patternmask configured for forming the thin film 60 has substantially the sameshape and size as those of an opening (hereinafter referred to as asecond opening) configured for forming an organic emission layer. Thethin film 60 may be formed of an organic material. In an embodiment, thefirst opening is not rotated with respect to the second opening; thefirst opening maintains the same orientation as that of the secondopening and is aligned with the second opening. The first opening mayappear to be a duplicate of the second opening that is shifted from theposition of the second opening to a different position.

FIG. 4 is a plan view provided for discussing some elements illustratedin FIG. 3 according to an embodiment of the present invention.

Referring to FIGS. 3 and 4, the center point of the thin film 60 maycoincide with the reference point P1 or may be spaced from the referencepoint P1. In embodiments of the invention, the thin film 60 does notoverlap the first mark 51 and does not overlap the second mark 52.

When images of the first mark 51, the second mark 52, and the thin film60 are captured (e.g., photographed) by the measurement equipment afterthe thin film 60 has been formed, the controller of the measurementequipment recognizes a center point P2 of the thin film 60 and thereference point P1 associated with the alignment mark 50 throughsoftware processing and measures distances dx (in the second direction)and dy (in the first direction) between the center point P2 of the thinfilm 60 and the reference point P1. The separation distances between thecenter point P2 of the thin film 60 and the reference point P1 aresubstantially equal (or equivalent) to errors in the alignment betweenthe substrate 100 and the pattern mask.

In an embodiment, the alignment mark 50 and the thin film 60 are usedfor identifying the error(s) in the alignment between the substrate 100and the pattern mask during the deposition process for forming theorganic emission layer 42. In an embodiment, the alignment mark 50 andthe thin film 60 do not need to overlap each other. In an embodiment,the alignment mark 50 and the thin film 60 do not overlap each other.

If a the thin film used for testing alignment overlaps an alignmentmark, the measurement equipment can recognize the center point of thealignment mark and the center point of the thin film and can measure theerror in the alignment between the substrate and the pattern maskthrough measuring distances between the two center points.

If a measurement range of the measurement equipment for measuring alocation of the thin film were limited by the alignment mark and if thethin film were required to overlap the alignment mark, measurement mightnot be correctly performed when the location of the thin film is notwithin the predetermined measurement range of the measurement equipmentor when the thin film does not overlap the alignment mark.

If the thin film overlaps the alignment mark, a measurement error mayoccur due to interference between an image of the alignment mark and animage of the thin film.

In an embodiment, the thin film 60 does not overlap the alignment mark50. Therefore, measurement range of the measurement equipment formeasuring the location of the thin film 60 may be maximized, andpotential image interference may be prevented. Advantageously,substantially accurate measurements may be obtained.

At least one thin film 60 may be formed for each color of the pixels PE.In an embodiment, the plurality of pixels PE includes at least twopixels PE having different shapes, at least one thin film 60 may beformed for each of the different shapes. In an embodiment, at least onefirst mark 51 may be formed for each color and/or each shape of thepixels PE.

In an embodiment, the plurality of pixels PE has three colors, such asred R, green G, and blue B as illustrated in FIG. 3; accordingly, thealignment mark 50 may include at least three first marks 51corresponding to the three colors. In an embodiment, since the centerline(s) corresponding to second mark(s) 52 may cross the center linescorresponding to the plurality of first marks 51 to set a plurality ofreference points P1, the number of second marks 52 may be smaller thanthe number of first marks 51. For example, the center line ofcorresponding to one second mark 52 may cross the three center linescorresponding to three first marks 51 to set three reference points P1.

Each of the at least three first marks 51 may be aligned with a centerline of a column of pixels PE configured for displaying red R, a centerline of a column of pixels PE configured for displaying green G, or acenter line of a column of pixels PE configured for displaying blue B.Further, each of the thin film 60 for the test of red R, the thin film60 for the test of green G, and the thin film 60 for the test of blue Bmay be formed on the reference points P1 set by the first mark 51 andthe second mark 52.

Locations and numbers of alignment marks 50 and thin films 60 are notlimited to the illustrated example and may be variously modified fordifferent embodiments.

In an embodiment, a cross key 59 configured for calibrating an alignmentbetween the substrate 100 and the measurement equipment may be formed inthe second area A20.

FIG. 5 is a plan view illustrating a portion of a substrate 101 for usein a display device according to an embodiment of the present invention.

Referring to FIG. 5, the substrate 101 may have components and featuresthat are analogous to components and features of the aforementionedsubstrate 100. The same reference numerals may be used for indicatingthe same components shared by the substrate 101 and the substrate 101.

The substrate 101 may include an alignment mark 501. The alignment mark501 includes a third mark 53 and a fourth mark 54 that are aligned inthe first direction. The alignment mark 501 further includes a fifthmark 55 and a sixth mark 56 that are spaced apart from the third mark 53and the fourth mark 54, respectively, by the same distance in the seconddirection. The fifth mark 55 and the sixth mark 56 are aligned in thefirst direction. The four marks 53, 54, 55, and 56 correspond to fourcorners of a virtual square or rectangle.

When images of the four marks 53, 54, 55, and 56 are captured (e.g.,photographed) by the measurement equipment, the controller of themeasurement equipment can recognize a virtual connection line between(the center of) the third mark 53 and (the center of) the sixth mark 56and a virtual connection line between (the center of) the fourth mark 54and (the center of) the fifth mark 55 through software processing. Thecontroller of the measurement equipment can recognize a point where thetwo connection lines intersect as a reference point P3. The center pointof the thin film 60 may coincide with the third reference point P3 ormay be spaced from the reference point P3. In embodiments of theinvention, the thin film 60 does not overlap any of the four marks 53,54, 55, and 56.

The third mark 53 and the fourth mark 54 may be located on a center linecorresponding to a first column of pixels PE in the first direction. Thefifth mark 55 and the sixth mark 56 may be located on a center linecorresponding to a second column of pixels PE in the first direction.The center of the fifth mark 55 and the center of the sixth mark 56 maybe spaced apart from the center of the third mark 53 and the center ofthe fourth mark 54 by a distance that is substantially equal to twice apitch p of the pixels PE in the second direction. In an embodiment, thereference point P3 set by the four marks 53, 54, 55, and 56 is locatedon a center line corresponding to a third column of pixels PE in thefirst direction, wherein the third column of pixels PE may be locatedbetween the first column of pixels PE and the second column of pixelsPE.

The distance between the center the fifth mark 55 and the center of thethird mark 53 (or the distance between the center of the sixth mark 56and the center of the fourth mark 54) may be set to be substantiallyequal to even multiples larger than double, such as quadruple orsextuple, of the pitch p of the pixels PE in the second direction. Sincethe lengths of the two connection lines become longer, for performingaccurate measurement, a measurement range of the measurement equipmentfor measuring the alignment mark 501 and/or the thin film 60 should beexpanded. In an embodiment, the inter-mark distance in the seconddirection is substantially equal to double of the pitch p of the pixelsPE.

FIG. 6 is a plan provided for discussing view of FIG. 5 according to anembodiment of the present invention.

Referring to FIGS. 5 and 6, when images of the alignment mark 501 andthe thin film 60 are captured (e.g., photographed) by the measurementequipment after the thin film 60 is formed, the controller of themeasurement equipment recognizes a center point P4 of the thin film 60and the reference point P3 associated with the alignment mark 501through software processing and measures distances dx and dy between thecenter point P4 of the thin film 60 and the reference point P3. Theseparation distances dx and dy between the center point P4 of the thinfilm 60 and the reference point P3 are substantially equal (orequivalent) to errors in the alignment between the substrate 101 and thepattern mask.

At least one thin film 60 may be formed for each color and/or each shapeof the pixels PE. At least one alignment mark 501 (which includes fourmarks 53, 54, 55, and 56) may be formed for each color and/or each shapeof the pixels PE. FIG. 5 illustrates two thin films 60 used forcalibrating pixels of two colors G and B and illustrates two alignmentmarks 501 surrounding the two thin films 60, respectively, as anexample.

FIG. 7 is a flowchart illustrating a method for forming at least oneelement on at least one substrate according to an embodiment of thepresent invention.

Referring to FIG. 7, in a first step S10, a mechanism (e.g., a robotarm) may dispose a substrate (which has at least an alignment mark 50 or501) and a pattern mask into a deposition chamber. In a second step S20,a thin film (or indicator) may be formed (e.g., deposited) on thesubstrate using an opening of the pattern mask. In a third step S30, ameasurement equipment may determine whether there is an error inalignment between the substrate and the pattern mask using an image ofthe alignment mark and an image of the thin film.

If there is an alignment error, in a fourth step S40, the alignmenterror is corrected. In a fifth step S50, an organic emission layer isformed in the substrate. The fourth step S40 is performed if analignment error is identified in the third step S30; the fourth step S40is omitted if no alignment error is identified in the third step S30.

FIG. 8 is a view schematically illustrating steps illustrated in FIG. 7according to an embodiment of the present invention. FIG. 9 is a planview illustrating a pattern mask according to an embodiment of thepresent invention.

Referring to FIGS. 7, 8, and 9, in the first step S10, the substrate 100and a pattern mask 70 are put into a deposition chamber 81 and are thenarranged. An alignment mark 50 illustrated in FIG. 3 or an alignmentmark 501 illustrated in FIG. 5 may exist in the second area A20 of thesubstrate 100. In the pattern mask, a first opening 71 for forming thethin film 60 may exist in an area that corresponds to the second areaA20 of the substrate 100, and a second opening 72 for forming theorganic emission layer 42 may exist in an area that corresponds to thefirst area A10.

A deposition source 82 is located inside the deposition chamber 81, andthe pattern mask 70 is located between the deposition source 82 and thesubstrate 100. The pattern mask 70 may be fixed to a frame 75 and may besubjected to a tensile force. The substrate 100 may be disposed betweenthe pattern mask 70 and a magnet unit 83, such that the pattern mask 70(which is formed of a metal material) may be attracted by the magnetunit 83 to contact the substrate 100.

In the second step S20, an organic material is evaporated throughheating the deposition source 82, such that a first evaporated organicmaterial may be generated. A first portion of the first evaporatedorganic material may pass through the first opening 71 of the patternmask 70 and may be deposited in the second area A20 on the substrate 100to form the thin film 60. Substantially simultaneously, a second portionof the first evaporated organic material may pass through the secondopening 72 and may be deposited in the first area A10 on the substrate100 to form an organic emission layer 42. That is, the organic emissionlayer 42 and the thin film 60 may be substantially simultaneouslyformed.

In the third step S30 or in a step between the steps S20 and S30, thesubstrate 100 having the thin film 60 formed thereon is withdrawn fromthe deposition chamber 81 and moved to the measurement equipment.Subsequently, a succeeding substrate may be input into the depositionchamber 81 and may be in a standby state. When the substrate 100 ismounted to the measurement equipment, the substrate 100 may beaccurately arranged in the measurement equipment using the cross key 59,which is formed in the second area A20. The cross key 59 may be used asa reference of a measurement location.

FIG. 10 is a view schematically illustrating the substrate and themeasurement equipment in the third step S30 illustrated in FIG. 7according to an embodiment of the present invention.

Referring to FIG. 10, in the third step 30, an error in the alignmentbetween the substrate 100 and the pattern mask 70 may be measured usingthe measurement equipment 90, which may include an image camera forcapturing (e.g., photographing) images of the alignment mark 50 and thethin film 60.

Referring to FIGS. 4 and 10, the alignment mark 50 includes the firstmark 51 and the second mark 52, each having a bar shape, and acontroller 91 of the measurement equipment 90 may recognize the pointwhere the center line corresponding to the first mark 51 and the centerline corresponding to the second mark 52 intersect as the referencepoint P1. The controller 91 of the measurement equipment 90 maydetermine the center point P2 of the image of the thin film 60 and maydetermine (e.g., measure) the error in the alignment between thesubstrate 10 and the pattern mask 70 by measuring distances between thecenter point P2 of the thin film 60 and the reference point P1.

Referring to FIGS. 6 and 10, the alignment mark 501 includes the marks53, 54, 55, and 56, and the controller 91 of the measurement equipment90 may recognize the point where the connection line between the thirdmark 53 and the sixth mark 56 and the connection line between the fourthmark 54 and the fifth mark 55 intersect as the reference point P3. Thecontroller 91 of the measurement equipment 90 may determine the centerP4 of the image of the thin film 60 and may determine (e.g., measure)the error in the alignment between the substrate 101 and the patternmask 70 by measuring distances between the center point P4 of the thinfilm 60 and the reference point P3.

Referring to FIG. 8, if a substrate-mask alignment error is identifiedin the third step S30, the alignment error is corrected by moving thepattern mask 70 or the succeeding substrate inside the depositionchamber 81 in the fourth step S40.

In the fifth step S50, an organic material is evaporated through heatingthe deposition source 82 to generate a second evaporated organicmaterial. A first portion of the second evaporated organic material maypass through the second opening 72 of the pattern mask 70 and may bedeposited on a succeeding substrate so as to form an organic emissionlayer 42. The substrate that has an alignment error identified in thethird step S30 may be determined as a faulty substrate and may bediscarded.

If no error in the alignment between the substrate 100 and the patternmask 70 is identified in the third step S30, the fourth step S40 isomitted, and the organic emission layer 42 is formed on the succeedingsubstrate through heating the deposition source 82 in the fifth stepS50. The substrate 100 with no identified alignment error in the thirdstep S30 may be determined as a substrate with acceptable quality andmay be transported to a subsequent process (e.g., a process for formingone or more of the hole injection layer, the hole transport layer, theelectron transport layer, the electron injection layer, and the commonelectrode).

In an embodiment, in the second step S20, the thin film 60 and theorganic emission layer 42 may not be simultaneously formed, but only thethin film 60 may be formed. If an alignment error is identified in thethird step S30, the alignment error is corrected by moving the substrate100 or the pattern mask 70 in the fourth step S40, and the organicemission layer 42 is formed in the fifth step S50. If no alignment erroris measured in the third step S30, the fourth step S40 is omitted, andthe organic emission layer 42 is formed in the fifth step S50.

While this disclosure has been described in connection with what ispresently considered to be practical embodiments, it is to be understoodthat the invention is not limited to the disclosed embodiments. Theinvention is intended to cover various modifications and equivalentarrangements included within the spirit and scope of the appendedclaims.

<Description of symbols> 100, 101: Substrate for a display device 10:Base substrate  20: Thin film transistor 30: Capacitor  40: Organiclight emitting diode 50, 501: Alignment mark  60: Thin film for a test70: Pattern mask  81: Deposition chamber 82: Deposition source

What is claimed is:
 1. A method for forming at least one element on atleast one substrate, the method comprising: disposing a first substrateand a mask in a chamber, wherein the first substrate includes a firstarea corresponding to a plurality of pixel positions, a second areaadjacent to the first area, a first mark disposed in the second area,and a second mark disposed in the second area and spaced from the firstmark, wherein a first virtual line corresponds to the first mark,wherein a second virtual line corresponds to the second mark andintersects the first virtual line at a first virtual reference point,and wherein the mask has a first opening and a second opening; using themask to form a first indicator in the second area, wherein the firstindicator is spaced from each of the first mark and the second mark andcorresponds to the first opening; and using positional relation betweenthe first virtual reference point and a point of the first indicator toassess a positional relation between the first substrate and the mask.2. The method of claim 1, further comprising: determining that adistance between the first virtual reference point and the point of thefirst indicator has a first value; determining that the first value isunacceptable; adjusting at least one of a position of the mask and aposition of the first substrate such that the distance between the firstvirtual reference point and the point of the first indicator has asecond value that is acceptable; and after the adjusting, using the maskto form a deposited element in a first pixel position of the pluralityof pixel positions, wherein the deposited element corresponds to thesecond opening.
 3. The method of claim 1, further comprising:determining that a distance between the first virtual reference pointand the point of the first indicator has a first value; determining thatthe first value is unacceptable; adjusting at least one of a position ofthe mask and a position of the first substrate such that the firstsubstrate is at an acceptable position and such that the distancebetween the first virtual reference point and the point of the firstindicator has a second value that is acceptable; after the adjusting,disposing a second substrate at the acceptable position; and using themask to form a first deposited element on the second substrate, whereinthe first element layer corresponds to the second opening.
 4. The methodof claim 3, further comprising: when forming the first indicator, usingthe mask to form a second deposited element in a first pixel position ofthe plurality of pixel positions, wherein the second deposited elementcorresponds to the second opening; and after the adjusting and beforedisposing the second substrate in the chamber, removing the firstsubstrate from the chamber.
 5. The method of claim 1, furthercomprising: determining that a distance between the first virtualreference point and the point of the first indicator is acceptable; andafter the determining, using the mask to form a deposited element in afirst pixel position of the plurality of pixel positions, wherein thedeposited element corresponds to the second opening.
 6. The method ofclaim 1, further comprising: when forming the first indicator, using themask to form a deposited element in a first pixel position of theplurality of pixel positions, wherein the deposited element correspondsto the second opening; and determining whether a distance between thefirst virtual reference point and the point of the first indicator isacceptable.
 7. The method of claim 1, wherein a first side of the firstmark is longer than a second side of the first mark and extends in afirst direction, wherein a first side of the second mark is longer thana second side of the second mark and extends in a second directiondifferent from the first direction.
 8. The method of claim 1, whereinthe first substrate further includes a third mark and a fourth mark,wherein the third mark is disposed in the second area and is spaced fromeach of the first mark and the second mark, wherein the fourth mark isdisposed in the second area and is spaced from each of the first mark,the second mark, and the third mark, wherein the first virtual linefurther corresponds to the fourth mark, wherein the second virtual linefurther corresponds to the third mark, wherein the first indicator isformed between the first mark and the fourth mark, and wherein the firstindicator is formed between the second mark and the third mark.
 9. Themethod of claim 8, wherein the first mark is aligned with the secondmark in a first direction, wherein the first mark is aligned with thethird mark in a second direction different from the first direction, andwherein the third mark is aligned with the fourth mark in the seconddirection.
 10. The method of claim 8, wherein a distance between acenter the first mark and a center of the third mark is equal to amultiple of a double of a distance between a center of a first pixelposition of the plurality of pixel positions and a center of a secondpixel position of the plurality of pixel positions, the second pixelposition immediately neighboring the first pixel position.